LAS VEGAS / SEOUL, December 31, 2025 — South Korea-based AI semiconductor company DEEPX will use CES 2026 as a global platform to articulate its ambition of becoming a foundational “Physical AI Infrastructure Company”, as artificial intelligence increasingly moves beyond data centres into real-world environments such as robotics, mobility, smart cities and industrial systems.
At CES 2026, DEEPX will outline a vision for AI infrastructure purpose-built for physical environments, where constraints around power consumption, heat dissipation and cost remain critical barriers to scale. The company’s approach centres on ultra-low-power, real-time AI semiconductors designed to enable intelligent decision-making directly at the edge, rather than relying solely on cloud-based architectures.
Drawing parallels with how low-power CPU architectures reshaped the computing industry, DEEPX said it aims to establish a new global standard for Physical AI by delivering energy-efficient AI accelerators capable of operating reliably and sustainably in real-world conditions. This positioning reflects growing demand for AI systems that can function autonomously in robots, drones, factories and intelligent infrastructure without the energy overheads associated with traditional data-centre-centric models.
The company’s technology has already gained international recognition. DEEPX-powered solutions have secured two CES Innovation Awards in the Computing Hardware and Embedded Technologies categories, while U.S. partner Sixfab won a CES Best of Innovation Award for its ALPON X5 AI Gateway, which is powered by DEEPX’s first-generation DX-M1 AI chip. The achievement underscores DEEPX’s role as a core AI infrastructure enabler rather than a component supplier alone.
At its CES 2026 booth in the AI & Robotics Zone at the Las Vegas Convention Center’s North Hall (Booth #8945), DEEPX will demonstrate commercial-scale deployments of its AI semiconductors across use cases including robotics, drones, factory automation, retail and intelligent infrastructure. The showcase is intended to illustrate how Physical AI has progressed from concept to real-world deployment.
DEEPX will also present performance targets for its next-generation DX-M2 AI chip, built on an advanced 2-nanometre process. Designed as a foundational infrastructure chip for the Physical AI era, DX-M2 aims to address power efficiency and scalability challenges associated with increasingly compute-intensive AI workloads outside traditional data centres.
In parallel, the company plans to launch an Open-Source Physical AI Alliance at CES, in collaboration with AI software ecosystems including Baidu’s PaddlePaddle and the Ultralytics YOLO community. The initiative reflects DEEPX’s strategy to integrate hardware and software more tightly, with the goal of accelerating global adoption of Physical AI through open, developer-friendly platforms.
Beyond the exhibition floor, DEEPX will host a media briefing on January 6 and an invitation-only CES Foundry forum on January 8, bringing together industry leaders from Hyundai Motor Group Robotics Lab, Baidu, Wind River, Ultralytics and the Edge AI Foundation to discuss pathways for scaling Physical AI across industries.
“CES 2026 marks a pivotal moment for DEEPX — not just showcasing technology achievements, but demonstrating how Physical AI becomes real infrastructure through global partnerships,” said Lokwon Kim, Chief Executive Officer of DEEPX.
CES 2026 will take place from January 6–9, 2026, in Las Vegas, bringing together global technology leaders, startups and policymakers to explore the next phase of AI-driven innovation.